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INTEGRATED CIRCUITS
DATA SHEET
TDA8005 Low-power smart card coupler
Product specification Supersedes data of 1995 Apr 13 File under Integrated Circuits, IC17 1996 Sep 25
Philips Semiconductors
Product specification
Low-power smart card coupler
FEATURES * VCC generation (5 V 5%, 20 mA maximum with controlled rise and fall times) * Clock generation (up to 8 MHz), with two times synchronous frequency doubling * Clock STOP HIGH, clock STOP LOW or 1.25 MHz (from internal oscillator) for cards power-down mode * Specific UART on I/O for automatic direct/inverse convention settings and error management at character level * Automatic activation and deactivation sequences through an independent sequencer * Supports the protocol T = 0 in accordance with ISO 7816, GSM11.11 requirements (Global System for Mobile communication); and EMV banking specification approved for Final GSM11.11 Test Approval (FTA) * Several analog options are available for different applications (doubler or tripler DC/DC converter, card presence, active HIGH or LOW, threshold voltage supervisor, etc. * Overloads and take-off protections * Current limitations in the event of short-circuit * Special circuitry for killing spikes during power-on or off * Supply supervisor * Step-up converter (supply voltage from 2.5 to 6 V) * Power-down and sleep mode for low-power consumption * Enhanced ESD protections on card side (6 kV minimum) * Control and communication through a standard RS232 full duplex interface * Optional additional I/O ports for: - keyboard - LEDs - display - etc. * 80CL51 microcontroller core with 4 kbytes ROM and 256-byte RAM. APPLICATIONS
TDA8005
* Portable smart card readers for protocol T = 0 * GSM mobile phones. GENERAL DESCRIPTION The TDA8005 is a low cost card interface for portable smart card readers. Controlled through a standard serial interface, it takes care of all ISO 7816 and GSM11-11 requirements. It gives the card and the set a very high level of security, due to its special hardware against ESD, short-circuiting, power failure, etc. Its integrated step-up converter allows operation within a supply voltage range of 2.5 to 6 V. The very low-power consumption in Power-down and sleep modes saves battery power. A special version where the internal connections to the controller are fed outside through pins allows easy development and evaluation, together with a standard 80CL51 microcontroller. Development tools, application report and support (hardware and software) are available. The device can be supplied either as a masked chip with standard software handling all communication between smart card and a master controller in order to make the application easier, or as a maskable device.
1996 Sep 25
2
Philips Semiconductors
Product specification
Low-power smart card coupler
QUICK REFERENCE DATA SYMBOL VDD IDD(pd) IDD(sm) IDD(sm) IDD(om) PARAMETER supply voltage supply current in power-down mode CONDITIONS doubler and tripler option VDD = 5 V; card inactive - - - - MIN. 2.5 - - - - - TYP.
TDA8005
MAX. 6.0 100 500 500 5.5
UNIT V A A A mA
supply current in sleep mode doubler card powered but clock stopped supply current in sleep mode tripler supply current in operating mode card powered but clock stopped unloaded; fxtal = 13 MHz; fC = 6.5 MHz; fcard = 3.25 MHz including static and dynamic loads on 100 nF capacitor operating limitation maximum load capacitor 150 nF (including typical 100 nF decoupling)
VCC
card supply voltage
4.75
5.0
5.25
V
ICC SR
card supply current slew rate on VCC (rise and fall)
- - 0.05
- - 0.1
20 30 0.15
mA mA V/s
tde tact fxtal Tamb
deactivation cycle duration activation cycle duration crystal frequency operating ambient temperature
- - 2 -25
- - - -
100 100 16 +85
s s MHz C
ORDERING INFORMATION TYPE NUMBER TDA8005G TDA8005H PACKAGE NAME LQFP64 QFP44 DESCRIPTION plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm VERSION SOT314-2 SOT307-2
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Philips Semiconductors
Product specification
Low-power smart card coupler
BLOCK DIAGRAM
V
handbook, full pagewidth
TDA8005
DDD 100 nF S1
47 nF
47 nF
S2 64 61
S3 3
S4 62
DDA 2.5 to 6 V 100 nF
V
63
10 SUPPLY
ALARM
44
INTERNAL REFERENCE
ref
STEP-UP CONVERTER VUP 60 INTERNAL OSCILLATOR 2.5 MHz V DDD S5 47 nF
DELAY
46
VOLTAGE SENSE 2.3 to 2.7 V alarm
RESET
22
TDA8005G
VDDD skill CONTROLLER CL51 4 kbytes ROM 256-byte RAM off start
osc ref 59
SECURITY VCC GENERATOR
LIS VCC 100 nF
RxD TxD AUX1 AUX2 INT1 P00 to P37
28 29 32 33 30
EN1
58
RST
EN2
RST BUFFER
56
RST
(1)
OPTIONAL PORTS SEQUENCER EN3 data clk EN R/W S0 S1 INT I/O BUFFER 55 I/O
PERIPHERAL INTERFACE
EN4
CLOCK BUFFER
57
CLK
Cclk ISO 7816 UART
I/O
47
PRES
CLOCK CIRCUITRY osc
OUTPUT PORT EXTENSION 37 2 53 52 51 50 49 4
MLD210
36
35
XTAL1
XTAL2 DGND AGND
K0
K1
K2
K3
K4
K5
(1) For details see Chapter "Pinning".
Fig.1 Block diagram (LQFP64; SOT314-2).
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Philips Semiconductors
Product specification
Low-power smart card coupler
PINNING PIN SYMBOL n.c. AGND S3 K5 P03 P02 P01 n.c. P00 VDDD n.c. TEST1 P11 P12 P13 P14 n.c. P15 P16 TEST2 P17 RESET n.c. n.c. n.c. n.c. n.c. RxD TxD INT1 T0 AUX1 AUX2 P37 XTAL2 XTAL1 DGND n.c. 1996 Sep 25 LQFP64 SOT314-2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 QFP44 SOT307-2 - 1 2 - 3 4 5 - 6 7 - 8 9 10 11 12 - 13 14 15 16 17 - - - - - 18 19 20 21 22 23 24 25 26 27 - not connected analog ground contact 3 for the step-up converter output port from port extension general purpose I/O port (connected to P03) general purpose I/O port (connected to P02) general purpose I/O port (connected to P01) not connected general purpose I/O port (connected to P00) digital supply voltage not connected DESCRIPTION
TDA8005
test pin 1 (connected to P10; must be left open-circuit in the application) general purpose I/O port or interrupt (connected to P11) general purpose I/O port or interrupt (connected to P12) general purpose I/O port or interrupt (connected to P13) general purpose I/O port or interrupt (connected to P14) not connected general purpose I/O port or interrupt (connected to P15) general purpose I/O port or interrupt (connected to P16) test pin 2 (connected to PSEN; must be left open-circuit in the application) general purpose I/O port or interrupt (connected to P17) input for resetting the microcontroller (active HIGH) not connected not connected not connected not connected not connected serial interface receive line serial interface transmit line general purpose I/O port or interrupt (connected to P33) general purpose I/O port (connected to P34) push-pull auxiliary output (5 mA; connected to timer T1 e.g. P35) push-pull auxiliary output (5 mA; connected to timer P36) general purpose I/O port (connected to P37) crystal connection crystal connection or external clock input digital ground not connected 5
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
PIN SYMBOL n.c. P20 P21 P22 P23 ALARM n.c. DELAY PRES TEST3 K4 K3 K2 K1 K0 TEST4 I/O RST CLK VCC LIS S5 S2 S4 VDDA S1 LQFP64 SOT314-2 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFP44 SOT307-2 - 28 - 29 30 - - 31 32 33 - - - - - 34 35 36 37 38 39 40 41 42 43 44 not connected general purpose I/O port (connected to P20) general purpose I/O port (connected to P21) general purpose I/O port (connected to P22) general purpose I/O port (connected to P23) open-drain output for Power-On Reset (active HIGH or LOW by mask option) not connected external capacitor connection for delayed reset signal card presence contact input (active HIGH or LOW by mask option) test pin 3 (must be left open-circuit in the application) output port from port extension output port from port extension output port from port extension output port from port extension output port from port extension test pin 4 (must be left open-circuit in the application) data line to/from the card (ISO C7 contact) card reset output (ISO C2 contact) clock output to the card (ISO C3 contact) card supply output voltage (ISO C1 contact) supply for low-impedance on cards contacts contact 5 for the step-up converter contact 2 for the step-up converter contact 4 for the step-up converter analog supply voltage contact 1 for the step-up converter DESCRIPTION
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Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
59 LIS
60 S5.
64 S1
62 S4
61 S2
55 I/O
53 K0
52 K1
51 K2
50 K3
63 V
58 V
49 K4 48 TEST3 47 PRES 46 DELAY 45 n.c. 44 ALARM 43 P23 42 P22 41 P21 40 P20 39 n.c. 38 n.c. 37 DGND 36 XTAL1 35 XTAL2 34 P37 33 AUX2 AUX1 32
handbook, full pagewidth
n.c. AGND S3 K5 P03 P02 P01 n.c. P00 V DDD n.c. TEST1 P11 P12 P13 P14
1 2 3 4 5 6 7 8
TDA8005G
9 10 11 12 13 14 15 16 TxD 29 INT1 30 n.c. 25 n.c. 26 n.c. 27 RESET 22 TEST2 20 RxD 28 P17 21 n.c. 23 P15 18 P16 19 n.c. 24 n.c. 17 T0 31
54 TEST4
DDA
CC
56 RST
57 CLK
MLD211
Fig.2 Pin configuration (LQFP64; SOT314-2).
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Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
handbook, full pagewidth
AGND S3 P03 P02 P01 P00 V DDD
1 2 3 4 5 6 7 8 9
34 TEST4
43 V DDA
38 V CC
36 RST
37 CLK
39 LIS
35 I/O
44 S1
42 S4
41 S2
40 S5
33 TEST3 32 PRES 31 DELAY 30 P23 29 P22
TDA8005H
28 P20 27 DGND 26 XTAL1 25 XTAL2 24 P37 23 AUX2
TEST1 P11
P12 10 P13 11 P14 12 P15 13 P16 14 TEST2 15 P17 16 RESET 17 RxD 18 TxD 19 INT1 20 T0 21 AUX1 22
MLD212
Fig.3 Pin configuration (QFP44; SOT307-2).
1996 Sep 25
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Philips Semiconductors
Product specification
Low-power smart card coupler
FUNCTIONAL DESCRIPTION Microcontroller The microcontroller is an 80CL51 with 256 bytes of RAM instead of 128. The baud rate of the UART has been multiplied by four in modes 1, 2 and 3 (which means that the division factor of 32 in the formula is replaced by 8 in both reception and transmission, and that in the reception modes, only four samples per bit are taken with decision on the majority of samples 2, 3 and 4) and the delay counter has been reduced from 1536 to 24. Remark: this has an impact when getting out of PDOWN mode. It is recommended to switch to internal clock before entering PDOWN mode (see "application report"). All the other functions remain unchanged. Please, refer to the published specification of the 80CL51 for any further information. Pins INT0, P10, P04 to P07 and P24 to P27 are used internally for controlling the smart card interface. Mode 0 is unchanged. The baud rate for modes 1 and 3 is:
SMOD f clk 2 ----------------- x -------------------------------------------------8 12 x ( 256 - TH1 )
TDA8005
Supply The circuit operates within a supply voltage range of 2.5 to 6 V. The supply pins are VDDD, DGND and AGND. Pins VDDA and AGND supply the analog drivers to the card and have to be externally decoupled because of the large current spikes that the card and the step-up converter can create. An integrated spike killer ensures the contacts to the card remain inactive during power-up or power-down. An internal voltage reference is generated which is used within the step-up converter, the voltage supervisor, and the VCC generator. The voltage supervisor generates an alarm pulse, whose length is defined by an external capacitor tied to the DELAY pin, when VDDD is too low to ensure proper operation (1 ms per 1 nF typical). This pulse is used as a RESET pulse by the controller, in parallel with an external RESET input, which can be tied to the system controller. It is also used in order to either block any spurious card contacts during controllers reset, or to force an automatic deactivation of the contacts in the event of supply drop-out [see Sections "Activation sequence" and "Deactivation sequence (see Fig.10)"]. In the 64 pin version, this reset pulse is output to the open drain ALARM pin, which may be selected active HIGH or active LOW by mask option and may be used as a reset pulse for other devices within the application.
2 The baud rate for mode 2 is: ----------------- x f clk 16 Table 1 BAUD RATE 135416 67708 45139 33854 27083 22569 16927 13542 11285 Mode 3 timing fclk = 6.5 MHz; VDD = 5 V SMOD 1 0 1 0 1 0 - - 0 TH1 255 255 253 254 251 253 - - 250 fclk = 3.25 MHz; VDD = 5 or 3 V SMOD - 1 - 0 - 1 0 1 0 TH1 - 255 - 255 - 253 254 251 253
SMOD
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Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
handbook, full pagewidth
Vth1 + Vhys1 Vth1 V DD
Vth2 VDEL
ALARM
MBH634
Fig.4 Supply supervisor.
Low impedance supply (pin LIS) For some applications, it is mandatory that the contacts to the card (VCC, RST, CLK and I/O) are low impedance while the card is inactive and also when the coupler is not powered. An auxiliary supply voltage on pin LIS ensures this condition where ILIS = <5 A for VLIS = 5 V. This low impedance situation is disabled when VCC starts rising during activation, and re-enabled when the step-up converter is stopped during deactivation. If this feature is not required, the LIS pin must be tied to VDD. Step-up converter Except for the VCC generator, and the other cards contacts buffers, the whole circuit is powered by VDDD and VDDA. If the supply voltage is 3 V or 5 V, then a higher voltage is needed for the ISO contacts supply. When a card session is requested by the controller, the sequencer first starts the step-up converter, which is a switched capacitors type, clocked by an internal oscillator at a frequency approximately 2.5 MHz. The output voltage, VUP, is regulated at approximately 6,5 V and then fed to the VCC generator. VCC and GND are used as a reference for all other cards contacts. The step-up converter may be
chosen as a doubler or a tripler by mask option, depending on the voltage and the current needed on the card. ISO 7816 security The correct sequence during activation and deactivation of the card is ensured through a specific sequencer, clocked by a division ratio of the internal oscillator. Activation (START signal P05) is only possible if the card is present (PRES HIGH or LOW according to mask option), and if the supply voltage is correct (ALARM signal inactive), CLK and RST are controlled by RSTIN (P04), allowing the correct count of CLK pulses during Answer-to-Reset from the card. The presence of the card is signalled to the controller by the OFF signal (P10). During a session, the sequencer performs an automatic emergency deactivation in the event of card take-off, supply voltage drop, or hardware problems. The OFF signal falls thereby warning the controller.
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Philips Semiconductors
Product specification
Low-power smart card coupler
Clock circuitry The clock to the microcontroller and the clock to the card are derived from the main clock signal (XTAL from 2 to 16 MHz, or an external clock signal). Microcontroller clock (fclk) after reset, and during power reduction modes, the microcontroller is clocked with fINT/8, which is always present because it is derived from the internal oscillator and gives the lowest power consumption. When required, (for card session, serial communication or anything else) the microcontroller may choose to clock itself with 12fxtal, 14fxtal or 12fINT. All frequency changes are synchronous, thereby ensuring no hang-up due to short spikes etc. Cards clock: the microcontroller may select to send the card 12fxtal, 14fxtal, 18fxtal or 12fINT (1.25 MHz), or to stop the clock HIGH or LOW. All transition are synchronous, ensuring correct pulse length during start or change in accordance with ISO 7816. After power on, CLK is set at STOP LOW, and fclk is set at 1 f 8 INT. Power-down and sleep modes The TDA8005 offers a large flexibility for defining power reduction modes by software. Some configurations are described below. In the power-down mode, the microcontroller is in power-down and the supply and the internal oscillator are
TDA8005
active. The card is not active; this is the smallest power consumption mode. Any change on P1 ports or on PRES will wake-up the circuit (for example, a key pressed on the keyboard, the card inserted or taken off). In the sleep mode, the card is powered, but configured in the Idle or sleep mode. The step-up converter will only be active when it is necessary to reactivate VUP. When the microcontroller is in Power-down mode any change on P1 ports or on PRES will wake up the circuit. In both power reduction modes the sequencer is active, allowing automatic emergency deactivation in the event of card take-off, hardware problems, or supply drop-out. The TDA8005 is set into Power-down or sleep mode by software. There are several ways to return to normal mode, Introduction or extraction of the card, detection of a change on P1 (which can be a key pressed) or a command from the system microcontroller. For example, if the system monitors the clock on XTAL1, it may stop this clock after setting the device into power-down mode and then wake it up when sending the clock again. In this situation, the internal clock should have been chosen before the fclk. Peripheral interface This block allows synchronous serial communication with the three peripherals (ISO UART, CLOCK CIRCUITRY and OUTPUT PORTS EXTENSION).
handbook, full pagewidth
RESET
P24 DATA
P07 P06 STROBE ENABLE
P27 REG0
P26 REG1
P25 R/W
P32 INT
PERIPHERAL CONTROL
clock configuration CC0 CC1 CC2 CC3 CC4 CC5 CC6 CC7 Uart configuration UC0 UC1 UC2 UC3 UC4 UC5 UC6 UC7 Uart transmit UT0 UT1 UT2 UT3 UT4 UT5 UT6 UT7 ports extension PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7
Uart receive UR0 UR1 UR2 UR3 UR4 UR5 UR6 UR7 Uart status register US0 US1 US2 US3 US4 US5 US6 US7
MBH635
Fig.5 Peripheral interface diagram.
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Philips Semiconductors
Product specification
Low-power smart card coupler
Table 2 Description of Fig.5 DESCRIPTION
TDA8005
BIT NAME
REG0 = 0, REG1 = 0, R/W = 0; CLOCK CONFIGURATION (Configuration after reset is cards clock STOP LOW, fclk = 18fINT) CC0 CC1 CC2 CC3 CC4 CC5 CC6 CC7 cards clock = 12fxtal cards clock = 14fxtal cards clock = 18fxtal cards clock = 12fINT cards clock = STOP HIGH fclk = 12fxtal fclk = 14fxtal fclk = 12fINT ISO UART RESET START SESSION LCT (Last Character to Transmit) TRANSMIT/RECEIVE not used
REG0 = 1, REG1 = 0, R/W = 0; UART CONFIGURATION (after reset all bits are cleared) UC0 UC1 UC2 UC3 UC4 to UC7
REG0 = 0, REG1 = 1, R/W = 0; UART TRANSMIT UT0 to UT7 LSB to MSB of the character to be transmitted to the card
REG0 = 1, REG1 = 1, R/W = 0; PORTS EXTENSION (after reset all bits are cleared) PE0 to PE5 PE6, PE7 PE0 to PE5 is the inverse of the value to be written on K0 to K5 not used
REG0 = 0, REG1 = 0, R/W = 1; UART RECEIVE UR0 to UR7 LSB to MSB of the character received from the card
REG0 = 1, REG1 = 0, R/W = 1; UART STATUS REGISTER (after reset all bits are cleared) US0 US1 US2 US3 US4 US5 to US7 UART TRANSMIT buffer empty UART RECEIVE buffer full first start bit detected parity error detected during reception of a character (the UART has asked the card to repeat the character) parity error detected during transmission of a character. The controller must write the previous character in UART TRANSMIT, or abort the session. not used
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Philips Semiconductors
Product specification
Low-power smart card coupler
USE OF PERIPHERAL INTERFACE Write operation: Select the correct register with R/W, REG0, REG1. Write the word in the peripheral shift register (PSR) with DATA and STROBE. DATA is shifted on the rising edge of STROBE. 8 shifts are necessary. Give a negative pulse on ENABLE. The data is parallel loaded in the register on the falling edge of ENABLE. Read operation:
TDA8005
Select the correct register with R/W, REG0 and REG1. Give a first negative pulse on ENABLE. The word is parallel loaded in the peripheral shift register on the rising edge of ENABLE. Give a second negative pulse on ENABLE for configuring the PSR in shift right mode. Read the word from PSR with DATA and STROBE. DATA is shifted on the rising edge of STROBE. 7 shifts are necessary.
Table 3
Example of peripheral interface READ CHARACTER ARRIVED IN UART RECEIVE(2) CLR REG0 CLR REG1 SET R/W CLR ENABLE SET ENABLE CLR ENABLE SET ENABLE MOV R2, #8 LOOP MOV C, DATA RRC A CLR STROBE SET STROBE DJNZ R2, LOOP SET DATA RET
CHANGE OF CLOCK CONFIGURATION(1) CLR REG0 CLR REG1 CLR R/W MOV R2, #8 LOOP RRC A MOV DATA C CLR STROBE SET STROBE DJNZ R2, LOOP CLR ENABLE SET ENABLE SET DATA RET
Notes 1. The new configuration is supposed to be in the accumulator. 2. The character will be in the accumulator.
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Philips Semiconductors
Product specification
Low-power smart card coupler
ISO UART The ISO UART handles all the specific requirements defined in ISO T = 0 protocol type. It is clocked with the cards clock, which gives the fclk/31 sampling rate for start bit detection (the start bit is detected at the first LOW level on I/O) and the fclk/372 frequency for ETU timing (in the reception mode the bit is sampled at 12ETU). It also allows the cards clock frequency changes without interfering with the baud rate. This hardware UART allows operating of the microcontroller at low frequency, thus lowering EM radiations and power consumption. It also frees the microcontroller of fastidious conversions and real time jobs thereby allowing the control of higher level tasks. The following occurs in the reception mode (see Fig.6): * Detection of the inverse or direct convention at the begin of ATR. * Automatic convention setting, so the microcontroller only receives characters in direct convention. * Parity checking and automatic request for character repetition in case of error (reception is possible at 12 ETU). In the transmission mode (see Fig.7): * Transmission according to the convention detected during ATR, consequently the microcontroller only has to send characters in direct convention. Transmission of the next character may start at 12 ETU in the event of no error or 13 ETU in case of error. * Parity calculation and detection of repetition request from the card in the event of error. * The bit LCT (Last Character to Transmit) allows fast reconfiguration for receiving the answer 12 ETU after the start bit of the last transmitted character. The ISO UART status register can inform which event has caused an interrupt. (Buffer full, buffer empty, parity error detected etc.) cf Peripheral Interface. This register is reset when the microcontroller reads the status out of it.
TDA8005
The ISO UART configuration register enables the microcontroller to configure the ISO UART. cf Peripheral Interface. After power-on, all ISO UART registers are reset. The ISO UART is configured in the reception mode. When the microcontroller wants to start a session, it sets the bits START SESSION and RESET ISO UART in UART CONFIGURATION and then sets START LOW. When the first start bit on I/O is detected (sampling rate fclk/31), the UART sets the bit US2 (First Start Detect) in the status register which gives an interrupt on INT0 one CLK pulse later. The convention is recognized on the first character of the ATR and the UART configures itself in order to exchange direct data without parity processing with the microcontroller whatever the convention of the card is. The bit START SESSION must be reset by software. At the end of every character, the UART tests the parity and resets what is necessary for receiving another character. If no parity error is detected, the UART sets the bit US1 (BUFFER FULL) in the STATUS REGISTER which warns the microcontroller it has to read the character before the reception of the next one has been completed. The STATUS REGISTER is reset when read from the controller. If a parity error has been detected, the UART pulls the I/O line LOW between 10.5 and 12 ETU. It also sets the bits BUFFER FULL and US3 (parity error during reception) in the STATUS REGISTER which warns the microcontroller that an error has occurred. The card is supposed to repeat the previous character.
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Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
handbook, full pagewidth
T/R = 0 or LCT = 1
start session and T/R = 0
SET ENABLE FSD clock starts INHIBIT I/O DURING 200 CLK
SAMPLE I/O EVERY 31 CLK I/O = 0
SET FSD STATUS REGISTER IN FSD IS ENABLED RESET EN FSD
5th bit SAMPLE I/O AT 186 AND EVERY 372 CLK 10th bit CONVERT AND LOAD CHARACTER IN RECEPTION BUFFER AT 10 ETU SET CONVENTION IF START SESSION = 1
(1)
parity error CHECK PARITY DISABLE I/O BUFFER BETWEEN 10 AND 12 ETU
SET BIT RECEPTION PARITY ERROR AT 10 ETU PULL I/O LINE LOW FROM 10.5 TILL 11.75 ETU
SET BIT BUFFER FULL AT 10 ETU RESET RECEPTION PART AT 12 ETU
(2)
MBH636
T/R =1
(1) The start session is reset by software. (2) The software may load the received character in the peripheral control at any time without any action on the ISO UART.
Fig.6 ISO UART reception flow chart.
When the controller needs to transmit data to the card, it first sets the bit UC3 in the UART CONFIGURATION which configures the UART in the transmission mode. As soon as a character has been written in the UART TRANSMIT register, the UART makes the conversion,
calculates the parity and starts the transmission on the rising edge of ENABLE. When the character has been transmitted, it surveys the I/O line at 11 ETU in order to know if an error has been detected by the card.
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Philips Semiconductors
Product specification
Low-power smart card coupler
If no error has occurred, the UART sets the bit US0 (BUFFER EMPTY) in the STATUS REGISTER and waits for the next character. If the next character has been written before 12 ETU, the transmission will start at 12 ETU. If it was written after 12 ETU it will start on the rising edge of ENABLE. If an error has occurred, it sets the bits BUFFER EMPTY and US4 (parity error during transmission) which warns the microcontroller to rewrite the previous character in the UART TRANSMIT register. If the character has been rewritten before 13 ETU, the transmission will start at
TDA8005
13 ETU. If it has been written after 13 ETU it will start on the rising edge of ENABLE. When the transmission is completed, the microcontroller may set the bit LCT (Last Character to Transmit) so that the UART will force the reception mode into ready to get the reply from the card at 12 ETU. This bit must be reset before the end of the first reception. The bit T/R must be reset to enable the reception of the following characters. When the session is completed, the microcontroller re-initializes the whole UART by resetting the bit RESET ISO UART.
handbook, full pagewidth
T/R
SET TRANSMIT ENABLE transmit register selected CONVERT, CALCULATE PARITY AND LOAD IN TRANSMIT SHIFT REGISTER
(1)
SHIFT EVERY ETU IF TRANSMIT ENABLE IS SET 10th bit shifted SET I/O BUFFER IN RECEPTION AT 10 ETU
parity error SAMPLE I/O AT 11 ETU
SET BIT TRANSMISSION PARITY ERROR AND BUFFER EMPTY AT 11 ETU
SET BIT BUFFER EMPTY AT 11 ETU
(2)
LCT = 1 RESET TRANSMIT PART AT 11 ETU FORCE RECEPTION MODE RESET TRANSMIT PART AND ENABLE TRANSMIT AT 12 ETU RESET TRANSMIT PART AND ENABLE TRANSMIT AT 13 ETU
T/R = 0
MBH637
(1) The transmit register may be loaded just after reading from the status register. (2) The software must reset the last character but before completion of the first received character.
Fig.7 ISO UART transmission flow chart.
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Philips Semiconductors
Product specification
Low-power smart card coupler
I/O buffer modes (see Fig.8) The following are the I/O buffer modes: 1. I/O buffer disabled by ENIO. 2. I/O buffer in input, 20 k pull-up resister connected between I/O and VCC, I/O masked till 200 clock pulses. 3. I/O buffer in input, 20 k pull-up resister connected between I/O and VCC, I/O is sampled every 31 clock pulses. 4. I/O buffer in output, 20 k pull-up resister connected between I/O and VCC. 5. I/O buffer in output, I/O is pulled LOW by the N transistor of the buffer. 6. I/O buffer in output, I/O is strongly HIGH or LOW by the P or N transistor. Output ports extension In the LQFP64 version, 6 auxiliary output ports may be used for low frequency tasks (for example, keyboard scanning). These ports are push-pull output types (cf use in software document). Activation sequence When the card is inactive, VCC, CLK, RST and I/O are LOW, with low impedance with respect to GND. The step-up converter is stopped. The I/O is configured in the reception mode with a high impedance path to the ISO UART, subsequently no spurious pulse from the card during power-up will be taken into account until I/O is enabled. When everything is satisfactory (voltage supply, card present, no hardware problems), the microcontroller may initiate an activation sequence by setting START LOW (t0): * The step-up converter is started (t1) * LIS signal is disabled by ENLI, and VCC starts rising from 0 to 5 V with a controlled rise time of 0.1 V/s typically (t2) * I/O buffer is enabled (t3) * Clock is sent to the card (t4) * RST buffer is enabled (t5).
TDA8005
In order to allow a precise count of clock pulses during ATR, a defined time window (t3; t5) is opened where the clock may be sent to the card by means of RSTIN. Beyond this window, RSTIN has no more action on clock, and only monitors the cards RST contact (RST is the inverse of RSTIN). The sequencer is clocked by fINT/64 which leads to a time interval T of 25 s typical. Thus t1 = 0 to 164T, t2 = t1 + 123T, t3 = t1 + 4T, t4 = t3 to t5 and t5 = t1 + 7T (see Fig.9). Deactivation sequence (see Fig.10) When the session is completed, the microcontroller sets START HIGH. The circuit then executes an automatic deactivation sequence: * Card reset (RST falls LOW) at t10 * Clock is stopped at t11 * I/O becomes high impedance to the ISO UART (t12) * VCC falls to 0 V with typical 0.1 V/s slew rate (t13) * The step-up converter is stopped and CLK, RST, VCC and I/O become low impedance to GND (t14). * t10 < 164T; t11 = t10 + 12T; t12 = t10 + T; t13 = t10 + 123T; t14 = t10 + 5T. Protections Main hardware fault conditions are monitored by the circuit * Overcurrent on VCC * Short circuits between VCC and other contacts * Card take-off during transaction. When one of these problems is detected, the security logic block pulls the interrupt line OFF LOW, in order to warn the microcontroller, and initiates an automatic deactivation of the contacts. When the deactivation has been completed, the OFF line returns HIGH, except if the problem was due to a card extraction in which case it remains LOW till a card is inserted.
1996 Sep 25
17
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
handbook, full pagewidth
activation
character reception with error
character reception without error
character transmission with error
character transmission without error
character reception without error
forced deactivation
I/O
OUT I/O BUFFER IN ISO UART MODE T R 1 2 3 4 54 3 4 1 6 3 6 3 3 4 3 1
MBH638
Fig.8 I/O buffer modes.
handbook, full pagewidth
tact
PRES OFF START fINT/64 VUP VCC I/O ENRST RSTIN CLK RST ENLI internal
MBH639
internal
t3
t5
Fig.9 Activation sequence.
1996 Sep 25
18
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
handbook, full pagewidth
PRES OFF START fINT/64 RST CLK I/O VCC VUP ENLI t10 internal t11 t12 t13 tde t14
MBH640
Fig.10 Emergency deactivation sequence after a card take-off.
1996 Sep 25
19
Philips Semiconductors
Product specification
Low-power smart card coupler
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDA VDDD Vn In1 PARAMETER analog supply voltage digital supply voltage all input voltages DC current into XTAL1, XTAL2, RX, TX, RESET, INT1, P34, P37, P00 to P03, P11 to P17, P20 to P23 and TEST1 to TEST4 DC current from or to AUX1, AUX2 DC current from or to S1 to S5 DC current into DELAY DC current from or to PRES DC current from and to K0 to K5 DC current from or into ALARM (according to option choice) continuous total power dissipation IC storage temperature electrostatic discharge on pins I/O, VCC, RST, CLK and PRES on other pins Tj HANDLING Operating Junction Temp. - Tamb = -20 to +85C CONDITIONS -0 -0 -0 - MIN.
TDA8005
MAX. 6.5 6.5 5 V V
UNIT
VDD + 0.5 V mA
In2 In3 In4 In5 In6 In7 Ptot Tstg Ves
-10 -30 -5 -5 -5 -5 - -55 -6 -2 -
+10 +30 +10 +5 +5 +5 500 +150 +6 +2 125
mA mA mA mA mA mA mW
oC
kV kV C
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. THERMAL CHARACTERISTICS SYMBOL Rth j-a LQFP64 QFP44 PARAMETER from junction to ambient in free air 70 60 K/W K/W VALUE UNIT
1996 Sep 25
20
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
CHARACTERISTICS VDD = 5 V; VSS = 0 V; Tamb = 25 C; for general purpose I/O ports see 80CL51 data sheet; unless otherwise specified. SYMBOL Supply VDD IDD(pd) IDD(sm) IDD(om) supply voltage supply current power-down mode supply current sleep mode Option dependant VDD = 5 V; card inactive VDD = 3V; " " card powered, but with clock stopped 2.5 - - - - 2 2.45 3.8 Vhys1 Vth2 VDEL IDEL tW IOH VOL IOL VOH fxtal fEXT hysteresis on Vth1 threshold voltage on DELAY voltage on pin DELAY output current at DELAY ALARM pulse width pin grounded (charge) VDEL = VDD (discharge) CDEL = 10 nF active LOW option; VOH = 5 V active LOW option; IOL = 2 mA active HIGH option, VOL = 0 V active HIGH option, IOH = -2 mA ALARM (open drain active HIGH or LOW output) HIGH level output current LOW level output voltage LOW level output current HIGH level output voltage - - - VDD - 1 2 0 - - - - - - 10 0.4 -10 - A V A V 40 - 4.6 -1.5 4 - - 90 500 5.5 3 - - - - 1.38 - -1 6.8 10 6.0 - - - - 2.3 3 4.5 350 - VDD -0.4 10 - V A A mA mA V V V mV V V A mA ms PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
supply current operating mode unloaded; fxtal = 13 MHz; fclk = 6.5 MHz; fcard = 3.25 MHz VDD = 3 V; fxtal = 13 MHz; fclk = 3.25 MHz; fcard = 3.25 MHz
Vth1
threshold voltage on VDD (falling)
supervisor option
Crystal oscillator (note 1) crystal frequency external frequency applied on XTAL1 16 16 MHz MHz
Step-up converter fINT VUP VLIS ILIS oscillation frequency voltage on S5 2 - - 6.5 - - 3 - MHz V
Low impedance supply (LIS) voltage on LIS current at LIS 0 - VDD 7 V A
1996 Sep 25
21
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
SYMBOL
PARAMETER
CONDITIONS
MIN. -0.3 -0.3 -
TYP. - - - - - - - - - - - - - - - - - - - - - - -
MAX.
UNIT
Reset output to the card (RST) Vinactive Iinactive VOL VOH tr tf Vinactive Iinactive VOL VOH tr tf fclk output voltage current from RST when inactive and pin grounded LOW level output voltage HIGH level output voltage rise time fall time IOL = 200 A IOH <-200 A CL = 30 pF CL = 30 pF when inactive when LIS is used; Iinactive = 1 mA current from CLK when inactive and pin grounded LOW level output voltage HIGH level output voltage rise time fall time clock frequency IOL = 200 A IOH <-200 A CL = 30 pF CL = 30 pF 1 MHz Idle configuration low operating speed middle operating speed high operating speed duty cycle CL = 30 pF Card supply voltage (VCC) Vinactive Iinactive Vcc output voltage current from VCC when inactive and pin grounded output voltage in active mode with 100 nF capacitor; static load (up to 20 mA) dynamic current of 40 nA ICC SR output current slew rate VCC = 5V VCC shorted to GND up or down (max capacitance is 150 nF) when inactive when LIS is used; Iinactive = 1 mA -0.3 -0.3 - Imax = 200 mA, fmax = 5 MHz, and - duration <400 ns 4.75 4.5 - - 0.04 - - 0.1 0.4 0.4 -1 - V V mA V when inactive when LIS is used; Iinactive = 1 mA 0.4 0.4 -1 0.4 1 1 V V mA V s s
-0.25 4 - - -0.3 -0.3 - -0.25 VCC-0.5 - - 1 - - - 45
VCC + 0.3 V
Clock output to the card (CLK) output voltage 0.4 0.4 -1 0.4 15 15 1.5 2 4 8 55 V V mA V ns ns MHz MHz MHz MHz %
VCC+0.25 V
5.25 5.5 -20 -40 0.16 mA mA V/s
1996 Sep 25
22
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
SYMBOL Data line (I/O) Vinactive Iinactive VOL VOH VIL VIH tr tf Rpu
PARAMETER
CONDITIONS
MIN. -0.3 -0.3 -
TYP. - - - - - - - - - -
MAX.
UNIT
output voltage current from I/O when inactive and pin grounded LOW level output voltage (I/O configured as an output)
when inactive when LIS is used; Iinactive = 1 mA
0.4 0.4 -1 0.3
V V mA V
IOL = 1 mA
-0.25 VCC+0.8 0 VCC+0.6 - - -
HIGH level output voltage (I/O IOH <-100 A configured as an output) input voltage LOW (I/O configured as an input) input voltage HIGH (I/O configured as an input) rise time fall time pull-up resistor connected to VCC when I/O is input shutdown current at VCC activation sequence duration deactivation sequence duration start of the window for sending clock to the card end of the window for sending clock to the card IIL = 1 mA IIL = 100 A CL = 30 pF CL = 30 pF see Table 4 for options
VCC+0.25 V 0.5 VCC 1 1 - V V s s
Protections ICC(sd) Timing tact tde t3(start) t5(end) - - - 140 - - - - 225 150 130 - s s s s - -30 - mA
Auxiliary outputs (AUX1, AUX2) VOL VOH VOL VOH VIL VIH IIH Note 1. The crystal oscillator is the same as OPTION 3 of the 80CL51. LOW level output voltage HIGH level output voltage IOL = 5 mA IOH = -5 mA IOL = 2 mA IOH = -2 mA IIL = -1 mA IIH = 100 A VIH=+5V - VDD - 1 - VDD - 1 - 0.7VDD 0.2 - - - - - - - 0.4 - V V
Output ports from extension (K0 to Kn) LOW level output voltage HIGH level output voltage 0.4 - V V
Card presence input (PRES) LOW level input voltage HIGH level input voltage HIGH level input current 0.6 - 3 V V A
1996 Sep 25
23
from system controller RESET
RX TX MMI-EN
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 LED2 R7
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
5 V(logic) LED1
1.5 1.5 R8
handbook, full pagewidth
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
1996 Sep 25 24
MMI-CLK MMI-REQ LIS
APPLICATION INFORMATION
Philips Semiconductors
Low-power smart card coupler
KEYBOARD
5V (analog) 100 nF 5 V(analog) 100 nF 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
4.7 nF
100 nF
47 nF
TDA8005G
NC8 NC7 NC6 NC5 C1 C2 C3 C4
NC1 NC2 NC3 NC4 C5 C6 C7 C8
CARD-READ-C702 K1 K2 5 V(logic) 100 k
MGC440
4.7 nF
Product specification
TDA8005
Fig.11 Possible GSM application.
ndbook, full pagewidth
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 LED1 R6
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
VDD
LED2
R7
33 pF
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
1996 Sep 25 25
AS R/W E
Philips Semiconductors
Low-power smart card coupler
KEYBOARD
VDD
100 nF
47 nF
3V 100 nF 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
47 nF 100 nF 47 nF
TDA8005G
C8 C7 C6 C5 NC1 NC2 NC3 NC4
C4 C3 C2 C1 NC5 NC6 NC7 NC8
CARD-READ-LM01 K1 K2
MGC439
4.7 nF 7.15 MHz 33 pF
Product specification
D7 D6 D5 D4
DISPLAY DRIVER AND DISPLAY
D3 D2 D1 D8
TDA8005
Fig.12 Possible stand-alone application.
Philips Semiconductors
Product specification
Low-power smart card coupler
Table 4 TDA8005 option choice form DESCRIPTION OPTION FUNCTION Analog options Step-up Supervisor RSTIN (fixed) START (fixed) STR (fixed) EN (fixed) OFF (fixed) 3S 3S 3S 3S 2S I/O I/O pull-up R_CLK R_RST ALARM PRES doubler (updo) or tripler (uptri) DESCRIPTION
TDA8005
FUNCTION Ports P00 P01 P02 P03 P04 P05 P06 P07 P10 P11 P12 P13 P14 P15 P16 P17 P20 P21 P22 P23 P24 P25 P26 P27 P30 P31 P32 P33 P34 P35 P36 P37
OPTION
2.3 (supervb, 3 (supervtr) or 4.5 (superVCI) low impedance (UARTl) or high impedance (UARTZ) 10, 20 or 30 k 0, 50, 100, 150 or 200 0, 50, 80, 130 or 180 active HIGH (alarmbufp) or active LOW (alarmbufn) active HIGH (prestopp) or active LOW (prestopn)
DATA (fixed) R/W (fixed) REG1 (fixed) REG0 (fixed)
1S 3S 3S 3S
INT (fixed)
1S
AUXI (fixed) AUX2 (fixed)
3S 3S
1996 Sep 25
26
Philips Semiconductors
Product specification
Low-power smart card coupler
PACKAGE OUTLINES LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
TDA8005
SOT314-2
c
y X A 48 49 33 32 ZE
e E HE wM bp 64 1 pin 1 index 16 ZD bp D HD wM B vM B vM A 17 detail X L Lp A A2 A1 (A 3)
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7 0o
o
12.15 12.15 11.85 11.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT314-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-01
1996 Sep 25
27
Philips Semiconductors
Product specification
Low-power smart card coupler
TDA8005
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1996 Sep 25
28
Philips Semiconductors
Product specification
Low-power smart card coupler
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP and QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA8005
Wave soldering is not recommended for LQFP or QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions: * Do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1). * Do not consider wave soldering QFP packages QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Sep 25
29
Philips Semiconductors
Product specification
Low-power smart card coupler
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8005
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Sep 25
30
Philips Semiconductors
Product specification
Low-power smart card coupler
NOTES
TDA8005
1996 Sep 25
31
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 615 800, Fax. +358 615 80920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. +30 1 4894 339/911, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
647021/1200/02/pp32
Date of release: 1996 Sep 25
Document order number:
9397 750 01154

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